鍍錫銅箔
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鍍錫銅箔
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TAIWAN HWA DAU TRADING CO.,LTD
Model：LF5-TH692-D
|
NO |
Material |
Item |
Data |
Standard |
|
1 |
PV Ribbon |
Features |
Bright surface, non-pollutant |
- |
|
2 |
Size |
6.35±0.2mm × 0.160±0.010mm |
By Micrometer |
|
|
3 |
Single Solder Layer |
5~10μm |
By X-ray Fluorescence |
|
|
4 |
Elongation |
≧25％ |
Ref. ASTM E8 |
|
|
5 |
Tensile Strength |
≤25 Kgf/mm2 |
Ref. ASTM E8 |
|
|
6 |
Camber |
±3mm/M |
By Ruler |
|
|
7 |
Packing |
For customer required |
- |
|
|
8 |
Storage |
12 months from manufacturing date with not
unpacked at room temperature |
- |
|
|
9 |
Characteristics |
Good uniformity and solderability, no
danger to health |
- |
|
|
10 |
Purpose |
Suitable for photovoltaic modules soldering |
- |
|
|
11 |
Bare Copper Flat Wire |
Content |
≧99.9% OFC |
Ref. ASTM B152 |
|
12 |
Size |
6.35±0.2mm × 0.150±0.005mm |
By Micrometer |
|
|
13 |
Conductivity |
≧99% IACs |
By 4-Point Probe
Milliohmmeter |
|
|
14 |
Solder Alloy |
Composition |
Sn99% above |
Ref. JIS-Z-3282 |
|
15 |
Liquidus |
227-228°c (surface of solder) |
By DSC |
Alloy Composition
|
Sn |
Cu |
Ag |
Ni |
Bi |
Zn |
Al |
Sb |
Fe |
As |
Cd |
Pb |
In |
Au |
|
Rem. |
0.5~
0.9 |
0.1
MAX |
0~
0.01 |
0.1
MAX |
0.001
MAX |
0.001
MAX |
0.05
MAX |
0.02
MAX |
0.03
MAX |
0.002
MAX |
0.05
MAX |
0.10
MAX |
0.05
MAX |
- 銅純度 ≧ 99.90% （無氧銅）
- 銅箔導電度： ≧ 99% IACs
- 抗拉強度： ≦ 25kgf/mm²
-
拉伸強度： ≧25% (銅箔寬度＜3mm); ≧15% (銅箔寬度≧3mm)
